-
2018.11
5 -
2018.10
31 -
2015.10
21- The characteristics of the eutectic solder
Eutect eutectic welding, eutectic welding process commonly used in welding field of semiconductor devices.[Details]
-
2015.10
10- At the bottom of the filling glue material safety data
The need to make security data is in accordance with the relevant instructions, safe operation and use of the information for our products.[Details]
-
2015.10
29- SMT patch red adhesive properties
SMT red gum is a single component of room temperature storage and rapid curing of epoxy resin adhesive, which allows low temperature curing, high speed micro coating can still be maintained without drawing, overflow, collapse of the stable shape, its "shear thinning" viscosity characteristics and low moisture absorption, very suitable for normal temperature hole printing SMT process, glue point shape is very easy to control, storage stability and has excellent thermal shock performance and electrical performance, use safety, fully comply with environmental requirements.[Details]