Shenzhen Hua Maoxiang Electronics Co., R & D and production of solder ball on May 2015 officially listed

Solder balls on the application of two classes, the class of applications is will the first level interconnect inverted chip (FC) mounted directly to the occasion, solder ball after cut chip wafer direct bonding in bare chip, in fc-bga package plays the role of chip and package substrate electrical interconnection. Another application is the second level interconnect welding, the application through special equipment will be tiny solder ball a grain of grain implantation to the encapsulation substrate on, by heating the solder and substrate connection plate is engaged. In the IC package (BGA, CSP), chip and motherboard welding, is achieved by heating the reflow furnace.