Eutect eutectic welding, eutectic welding process commonly used in welding field of semiconductor devices, has two characteristics:

1. Preformed commonly used welding used solder welding, now also has the use of solder paste, solder paste used tin powder lines to solid phase and liquid phase, or is a temperature of melting point, the fast eutectic welding process does not produce tin beads.

2. The eutectic welding equipment is dedicated, ultrasonic eutectic welding equipment, the cost is very high, and contact way of welding.

Our company existing solder paste flux ratio is 10.5% - 10.5%, content is less, few residues after welding, also suitable for eutectic solder.