HX - 2000 applies to all with high power LED lamp bead coating of metal chips encapsulation, using solid crystal solder paste encapsulation of LED lamp bead, secondary flow, it is recommended to use our lead-free tin bismuth and tin bismuth silver alloy solder paste in low temperature, if there is no environmental requirements, you can use our tin lead or tin lead silver alloy solder paste.

One, the product features

1. This product is a halogen free solder paste, residue is easy to clean, can make disposable solder paste, do not affect the LED luminous effect.

2. High thermal conductivity, electrical conductivity, SAC305X alloy thermal conductivity is 50-70 w/M, K.

3. The bond strength is greater than the silver glue, long working hours.

4. Suitable for printing solid crystal craft, good thixotropy, has a solid crystal and dispensing need appropriate viscosity, good dispersion.

5. Solder paste using superfine powder diameter, suitable for more than 10 mil LED suits chip and length is more than 20 mil and electrode gap is larger than 150 um LED flip chip welding.

6. Use reflow furnace welding or constant temperature welding machine welding, recommended reflow furnace welding way, in favor of the control of the welding conditions consistent with mass action.

7. The solid crystal silver solder paste is far lower than the cost of glue and Au80Sn20 alloy, and solid crystal process saving energy consumption.