Huamao xiang HX2100 module glue is single-component low temperature heat curable epoxy resin adhesive quickly. In a relatively low temperature, fast curing, a very short time in a variety of different types of material between the formation of excellent stick relay. Product performance is good, has the high storage stability.

Product features:

1, fast, low temperature curing;

2, strong adhesive ability;

3, high storage stability, long work time, not easy to do;

4, don't flow in the process of curing rubber, without burrs treatment.

Main application:

1, memory card, camera VCM motor;

2, CCD/CMOS and other products;

3, can also be used for all kinds of active and passive components in the PCBA assembly adhesive, reinforcement, etc.

Recommended curing conditions:

1. 80 ℃ curing 5 ~ 10 min;

2. 70 ℃ curing 15 ~ 25 min;

3. 60 ℃ curing 25 ~ 35 min.

Note: heating binding site may need a certain amount of time so as to achieve the curing temperature. Curing conditions will be different because of different devices.