Huamao xiang HX619 is one kind of one-component epoxy encapsulant, this product is a low temperature heat curable epoxy resin adhesive quickly. In a relatively low temperature, extremely short period of time, in a variety of different types of material between the formation of excellent stick relay. Product performance is good, has the high storage stability. Suitable for low temperature curing process, mainly used in adhesive thermal sensitivity components, applicable to the memory card, CCD/CMOS device can also be used for all kinds of active and passive components in the PCBA assembly adhesive reinforcement, etc.

Typical curing conditions

Recommended curing conditions:

1. 80 ℃ curing 5 ~ 10 min;

2. 70 ℃ curing 15 ~ 25 min;

3. 60 ℃ curing 25 ~ 35 min.

Note: heating binding site may need a certain amount of time so as to achieve the curing temperature. Curing conditions will be different because of different devices.