Fill at the bottom of the rubber is mainly used in flip chip, CSP, BGA, memory card, CCD/CMOS devices. Flow through the capillary effect, form a uniform and there is no hole at the bottom of the packed bed, disperse stress caused by temperature impact and physical impact, in order to improve the component in bending, vibration, drop, or when the reliability of the high and low temperature cycle.

Product features:

1, one-component, rapid curing, wide scope of application, simple operation process;

2, liquidity is fast, even without gap filling;

3, seismic, high low-temperature impact resistance, easy to repair.

Main application:

1, used for chip corners;

2, used in and around the chip cofferdam;

3, used for chip at the bottom of the filling.

Recommended curing conditions:

1. 120 ℃ curing 10 min;