BGA solder ball
BGA Solder paste
BGA solder ball is used instead of IC components encapsulation structure of pin, to meet the requirements of the electrical interconnection and mechanical connection of a connecting piece. Its terminal products for laptop, mobile communication equipment (mobile phone, high frequency communications equipment), LED, LCD, DVD, computer, PDA, motherboard for vehicle LCD TV, home theater, AC3 systems, satellite positioning system and other consumer electronics products. BGA/CSP packaging a complied with the trend of the development of the technology and the development of satisfied people short of electronic products, small, light and thin.
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