Bottom filling adhesive Features:
One component rapid curing, wide application range, simple operation process. Flow fast, uniform gap filling, seismic, high and low temperature impact, easy to repair. Through the capillary flow, a uniform and no hole filling layer is formed. The stress caused by the temperature and physical shock is dispersed, and the reliability of the component is improved. Mainly used in flip chip, CSP and BGA, memory card, CCD/CMOS and other devices.
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