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  • 2015.10
    21
    The characteristics of the eutectic solder
    The characteristics of the eutectic solder

    Eutect eutectic welding, eutectic welding process commonly used in welding field of semiconductor devices.[Details]

  • 2015.10
    10
    At the bottom of the filling glue material safety data
    At the bottom of the filling glue material safety data

    The need to make security data is in accordance with the relevant instructions, safe operation and use of the information for our products.[Details]

  • 2015.10
    29
    SMT patch red adhesive properties
    SMT patch red adhesive properties

    SMT red gum is a single component of room temperature storage and rapid curing of epoxy resin adhesive, which allows low temperature curing, high speed micro coating can still be maintained without drawing, overflow, collapse of the stable shape, its "shear thinning" viscosity characteristics and low moisture absorption, very suitable for normal temperature hole printing SMT process, glue point shape is very easy to control, storage stability and has excellent thermal shock performance and electrical performance, use safety, fully comply with environmental requirements.[Details]

  • 2015.9
    23
    Red rubber thrust test instruction
    Red rubber thrust test instruction

    SMT red glue is the thrust of the original device in the PCB board after the use of force to calculate the tension force, the general tension is more show that the higher the viscosity of red glue, the better, the original device is not easy to fall off[Details]

  • 2015.9
    9
    Overview of welding products
    Overview of welding products

    Welding is a metal chemical bond is formed between the solder and metal, solder molecules penetrate into the substrate surface metal of molecular structure, and the formation of a strong, completely metal structure. When the solder melting, it is impossible to completely from the metal surface to erase it, because it has become a part of the base metal.[Details]

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