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2015.11
19- 260 degrees high temperature solid crystal research and development of solder paste
HX - 1100 applies to all with high power LED lamp bead coating of metal chips encapsulation, the HX - 1100 solid crystal solder paste encapsulation of LED lamp bead, can satisfy the reliability of the peak temperature of 265 ℃ when the secondary circumfluence, suitable for ceramic substrate support, can withstand the high temperature of high power LED packaging.[Details]
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2015.10
21- The characteristics of the eutectic solder
Eutect eutectic welding, eutectic welding process commonly used in welding field of semiconductor devices.[Details]
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2015.10
10- At the bottom of the filling glue material safety data
The need to make security data is in accordance with the relevant instructions, safe operation and use of the information for our products.[Details]
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2015.10
29- SMT patch red adhesive properties
SMT red gum is a single component of room temperature storage and rapid curing of epoxy resin adhesive, which allows low temperature curing, high speed micro coating can still be maintained without drawing, overflow, collapse of the stable shape, its "shear thinning" viscosity characteristics and low moisture absorption, very suitable for normal temperature hole printing SMT process, glue point shape is very easy to control, storage stability and has excellent thermal shock performance and electrical performance, use safety, fully comply with environmental requirements.[Details]
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2015.9
23- Red rubber thrust test instruction
SMT red glue is the thrust of the original device in the PCB board after the use of force to calculate the tension force, the general tension is more show that the higher the viscosity of red glue, the better, the original device is not easy to fall off[Details]